What is QFN Package? The Quad Flat No-Leads Package (QFN) is a surface-mount type of packaging characterized by its square shape and the absence of external leads. Instead, it features conductive pads (pins) for electrical connections along its four sides, with typical pin pitches of 0.65mm, 0.5mm, 0.4mm, and 0.35mm. Due to the lack of […]
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What is a SOIC package? The Small Outline Integrated Circuit (SOIC) package is a type of surface-mount IC package that is widely used in the electronics industry. It was first introduced by the electronics company Texas Instruments in 1985. The SOIC package is a rectangular plastic package with leads on two sides. The leads are
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What is Dual Inline Package? DIP, or dual inline package, is a type of integrated circuit (IC) packaging that features two parallel rows of metal pins, called dual in-line pins, on either side of a rectangular-shaped circuit. DIP packages can be soldered onto a printed circuit board or inserted into a DIP socket. DIP chips
In recent years, the redistribution layer (RDL) technology has gained significant traction. It’s a revolutionary packaging solution that has transformed the way we package ICs. In this article, we’ll explore the definition of RDL, its function, benefits, process, application, and comparision with other IC packaging technologies. What is Redistribution Layer Technology? Redistribution layer, also known
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System in a Package (SiP) technology has revolutionized the way electronic components are packaged and integrated into devices. SiP technology allows for more components to be integrated into a much smaller package, making it easier to design and manufacture smaller and more efficient electronic devices. In this blog post, I will discuss what System in
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IC testing is to detect whether the chip has design defects or physical defects caused by the manufacturing process. The process can be conducted by using various test methods. IC packaging is the process of enclosing an integrated circuit (IC) in a protective package. This process protects the IC from damage and ensures that it
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BGA is a commonly used component on PCB, usually CPU, NORTH BRIDGE, SOUTH BRIDGE, AGP CHIP, CARD BUS CHIP, etc. They are mostly packaged in bga type. In short, 80% of high-frequency signals and special signals will be pulled by this type of package. Therefore, how to deal with the routing of the BGA package
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