New to QFN (Quad Flat No-Lead) packages? Learn pin layout, thermal pad design, and reflow soldering best practices. Avoid common issues like tombstoning and poor thermal conductivity. Step-by-step for compact PCB designs!
The Basics of Quad Flat No-Leads (QFN) Packaging Read More »
SOIC small-outline ICs: pin spacing, thermal management, and SMT assembly tips. Compare with DIP for compact PCB designs. Best practices inside!
Learn DIP package basics: pin configurations, pros/cons, and through-hole soldering. Compare with SMD for your design. Layout tips for reliability. Read now!
In recent years, the redistribution layer (RDL) technology has gained significant traction. It’s a revolutionary packaging solution that has transformed the way we package ICs. In this article, we’ll explore the definition of RDL, its function, benefits, process, application, and comparision with other IC packaging technologies. What is Redistribution Layer Technology? Redistribution layer, also known
Redistribution Layer (RDL) Technology for ICs Package Read More »
System in a Package (SiP) technology has revolutionized the way electronic components are packaged and integrated into devices. SiP technology allows for more components to be integrated into a much smaller package, making it easier to design and manufacture smaller and more efficient electronic devices. In this blog post, I will discuss what System in
Revolutionizing Electronics with System in a Package Technology Read More »
IC testing is to detect whether the chip has design defects or physical defects caused by the manufacturing process. The process can be conducted by using various test methods. IC packaging is the process of enclosing an integrated circuit (IC) in a protective package. This process protects the IC from damage and ensures that it
IC Packaging and IC Testing Market Landscape Analysis Read More »
BGA is a commonly used component on PCB, usually CPU, NORTH BRIDGE, SOUTH BRIDGE, AGP CHIP, CARD BUS CHIP, etc. They are mostly packaged in bga type. In short, 80% of high-frequency signals and special signals will be pulled by this type of package. Therefore, how to deal with the routing of the BGA package
Well Done Technology was established in 2008, focus on reverse engineering, IC unlock, PCB Clone and design. Our technical team of more than 40 people includes senior engineers with rich experience.
