Professional IC Reverse Engineering & Technical Analysis

Integrated circuit design analysis, firmware recovery, and semiconductor research. Requests require a defined engineering objective and documented authority over the device and relevant code. Feasibility depends on the exact model and protection state.
In-depth Analysis

What is IC Reverse Engineering (RE)?

IC reverse engineering examines a chip’s structure, circuitry and embedded behavior for a defined engineering purpose.
Standard analysis includes structural inspection, circuit analysis and firmware backup through permitted interfaces, without bypassing security protections.
Chip unlocking, read-protection bypass and protected-firmware extraction are assessed and quoted separately, outside standard analysis or backup services. Acceptance requires documented authorization covering the device, code and intended use, plus a technical feasibility review. Recovery is not guaranteed.

Physical Extraction

Delayering circuits through chemical etching or mechanical polishing.

Logic Recovery

Using high-res SEM imagery to extract transistor-level connectivity.

“It is not just duplication; it is a vital tool for deep understanding of advanced nodes and patent protection.”

METAL 3 (Top Layer)
METAL 2
METAL 1
POLY / TRANSISTOR LAYER
SCANNING STATUS: 100% COMPLETE

Core Chip Types for Reverse Engineering

MCU

MCU

FPGA

FPGA

CPLD

CPLD

ARM

ARM

Digital Signal Processor (DSP)

DSP

Our IC reverse engineering Capability

Supportable IC Series & Models

With over 15 years of experience, we have completed 1,000+ hardware analysis and firmware recovery projects. Our clients range from innovative startups to global enterprises in industries such as Automotive, Aerospace, Industrial Automation, Medical Devices, and Telecommunications. We are the preferred partner for businesses requiring deep-level hardware insights and legacy system support. For more IC models, please contact us directly.

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How to reverse engineer a microchip?

Our professional methodologies for chip analysis and data recovery.

IC reverse engineeing by software: Pocket-CHM-Pro-59

1. Firmware Protocol & Logic Analysis

We utilize advanced protocol analysis to identify logical sequences within firmware. By analyzing execution timing and erase sequences in legacy architectures like the ATMEL AT89C series, we identify states where memory becomes accessible. Our team maps firmware structures by detecting data patterns, such as FFFF hex sequences, while assessing the feasibility of recovery or migration to modern hardware platforms.

A high-resolution display showing a DPA correlation graph with sharp red spikes against blue noise, positioned in front of a blurred hardware hacking setup featuring a circuit board, data acquisition unit, and an engineer's hands using a multimeter probe.

2. Side-Channel Power Analysis

This non-invasive technique monitors power consumption and electromagnetic emissions during chip operation. By applying advanced statistical models, we can infer logic states and execution patterns without physical intrusion. This methodology is crucial for understanding internal device operations and cryptographic processes, providing a deep look into the chip’s functional behavior and data flow.

A first-person perspective of a technical workbench featuring two monitors. The left screen shows oscilloscope waveforms and a logic analyzer with flatlined channels. The right screen displays a disassembler's control flow graph with a red-highlighted interrupt. A hand rests on a keyboard in the foreground under a desk lamp.

3. Environmental Stress Testing

By applying controlled voltage glitches or clock transients, we analyze processor behavior under abnormal operational conditions. This stress methodology helps in identifying hidden design vulnerabilities and improving overall system robustness. It allows engineers to pinpoint critical failure points and reconstruct control flow logic that only emerges during specific environmental fluctuations or hardware exceptions.

schematic of test probe on pcb

4. Internal Micro-Probing

Using high-precision probe stations, we investigate internal wiring and signal behavior in an agreed research or recovery scope. Probing beyond package-level security pins can expose protected internal signals, so any such request requires documented authority covering both the device and the data. Intrusive work can damage the sample and does not guarantee firmware recovery.

A high-contrast shot of a flat substrate under intense blue-violet ultraviolet light, showing a faint rectangular circuit pattern and a squeegee tool at the bottom edge.

5. OTP / EPROM Preservation Assessment

UV exposure can alter or erase stored charge in UV-erasable EPROM devices; it does not reconstruct the original firmware after erasure. Device identification and the preservation of any readable data must precede an authorized assessment. Do not treat UV irradiation as a general recovery method for OTP memory or discontinued industrial chips.

IC Restore Functionality: finding logic gap in chip code

6. Architectural Security Evaluation

We leverage architectural design characteristics for advanced data recovery. By identifying specific hardware flags or logical flip-flops (FFs) within the memory structure, we evaluate the chip’s state for precise firmware extraction. This methodology is highly effective for the ATMEL 51 (AT89C51) series, where byte-level analysis allows engineers to restore access to critical code lost to hardware obsolescence.

FIB-(focused-ion-beam)-(2)

7. FIB-Based Circuit Logic Restoration

Focused Ion Beam (FIB) technology is our premier method for precision circuit restoration. After chemical decapsulation, we use electron microscopy to modify internal logic paths at the nanometer scale. This is ideal for TI MSP430 series (MSP430F1101A, F149, F425) projects involving security fuses. By restoring circuit states, we enable firmware recovery from protected devices when original source code is unavailable. Requests involving security-fuse modification or protected-firmware recovery require a separate review of authority, device-specific feasibility, and destructive-test consent. A listed chip model is not a promise of access to its code.

A hyper-realistic macro SEM view of a silicon chip showing exposed metallic interconnect layers labeled "metal 1" and "metal 3," with a glowing translucent digital schematic in cyan and amber superimposed over the nanometer-scale transistors and vias.

8. Logic Path Reconstruction

For high-complexity CPLD and DSP chips, we perform deep-level structural analysis to bypass non-functional logic gates and restore access to core system data. This process involves reconstructing complex netlists and identifying hidden signal paths within the silicon fabric. It is particularly effective for the TMS320 series, enabling researchers to recover proprietary processing algorithms for R&D purposes. Any request to access or reproduce proprietary algorithms must include permission from the relevant rights holder and an agreed limit on the use of recovered data.

Frequently Asked Questions

How long does IC reverse engineering take?

Simple decapsulation takes 1-3 days. Full netlist extraction can take 2-12 weeks depending on the chip’s complexity and node size.

Costs vary widely. A basic structural analysis might start at $5k, while full circuit extraction for advanced nodes can range from $50k to over $200k.

Protected-MCU firmware extraction is a security-sensitive service. A request must identify the device, protection state, intended use, and documented authority from the relevant device and code rights holders. Ownership of a physical sample alone does not establish permission to extract third-party code. Recovery is assessed case by case and cannot be guaranteed.

Explore More About IC Knowledges

Contact Us

Phone: +86 157 9847 6858
Email: info@reversepcb.com

Room 602, Building 7A, Phase 2, Dongjiu Innovation Technology Park, No. 73 Xialinan Road, Nanwan Street, Longgang District, Shenzhen, China.

MON-FRI 09:00 - 19:00, SAT-SUN 10:00 - 14:00
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