Surface-Mount Technology (SMT)

Well Done provides various of surface-mount technology service like (SMT processing), patch processing, SMT patch processing, automatic plug-in (AIM), and various types of circuit boards.

What is Surface-Mount Technology?

Surface-mount technology (SMT) is a electronic assembly process of mounting leadless or short lead surface mount components (SMC/SMD) on the surface of a printed circuit board (PCB) or on the surface of other substrates, and then soldering and assembling by reflow soldering or dip soldering.


Types of Surface-Mount Technology

our PCB design and debugging engineers will guarantee to make 100% accurate schematic diagrams and perfect prototypes for you.


Sort by size

There are 3 main types of surface-mount technology: small-outline package (SOP), surface-mount device (SMD) and ball grid array (BGA). The first two are smaller form factor components, while the last is larger. The size of your component will determine which type of surface mount technology it uses.

Chip decryption and PCB reverse design of new energy vehicle circuit boards

Sort by process

Through-hole technology, and Soldering Techniques and Tape-out technology. Through-hole technology uses sockets and mating pins to mechanically attach components to circuit boards. Tape-out technology uses adhesive tapes instead of sockets to attach components to circuit boards.

surface mount technology applications

Surface Mount Technology Pros and Cons

There are many benefits of surface mount technology, but the disadvantages are also obviously as below. 



Surface Mount Technology Process Flow

Under normal circumstances, the electronic products we use are designed by pcb plus various capacitors, resistors and other electronic components according to the designed circuit diagram, so different electrical appliances require various smt processes to process. The following is our SMT process flow:

Solder Paste Printing (Jet Printing)

First, fix the template for the mold for printing solder paste (or directly program it on the solder paste inkjet printer), and then print the solder paste on the PCB.

SMC Placement

The PCB board that has completed solder paste printing passes through the automatic production line and enters the high-speed placement machine to start the regular placement of the packaged devices.

Mounting of core components (BGA, IC)

Select a high-precision placement machine to mount core devices such as (IC chips, various functional chips, BGA).

reflow soldering

Solder is melted by different heating methods such as reflow oven, infrared heating lamp or heat gun to bond SMT electronic components to printed circuit boards.

AOI Test

AOI inspection is adopted for PCB boards without obvious defects. The inspection equipment collects images of each solder joint on the PCB through a camera and compares it with the previously imported data.

DIP plug-in finished wave soldering

Qualified products will be sent to the DIP plug-in area for the installation of plug-in components.

Our SMT Services

We offer a wide range of services to help your business grow. These include consulting, design, engineering, manufacturing, and surface mount technology assembly.
Our team of experts has extensive experience in SMT and can help you select the right solutions for your specific needs. We work closely with our customers to understand their needs and offer solutions that will increase productivity and profitability.

Fast sample SMT processing

For the SMT processing of incoming samples in the research and development stage, a single BGA represents incoming welding processing, and the entire SMT processing; the quantity is 1-100 pieces, and generally one day delivery (the delivery time depends on the complexity of the specific circuit board) condition).

Small batch SMT processing

The product research and development is completed to prepare for the mass production of the product; the first trial production, the number of incoming samples SMT processing and incoming production of about 101-1000 units; including the single BGA incoming welding processing, the whole board SMT processing ; Generally, it will be delivered within 3-5 working days (the delivery time depends on the complexity of the circuit board).

Medium-volume production SMT processing

The production volume of each batch is not large, but the number of products that need to be completed quickly is 1001-5000 units. We provide fast production speed and undertake the production of incoming samples; including single BGA incoming welding processing, the entire SMT processing ;Generally, it will be delivered within 5-7 working days (the delivery time depends on the complexity of the circuit board).

How to Order SMT from Well Done?

lead form

Submit Requirement

Submit your requirement details of pcb assembly on the form, upload your files is available. And we'll reply to you within 24 hours.


Confirm PCB Project

Our expert will contact you for the project details, reply to you with a quotation, and confirm the order after recieving your payment.


Sample Prototype

The sample will be arranged to produce as you expect within 1 day, then we confirm with you the appearance and function.


Delivery Goods

Lead time: At last, your sample w'll be finally shipped to you within 7-15 days. It'll depends the shipping way you choose.