System in a Package (SiP) technology has revolutionized the way electronic components are packaged and integrated into devices. SiP technology allows for more components to be integrated into a much smaller package, making it easier to design and manufacture smaller and more efficient electronic devices. In this blog post, I will discuss what System in a Package technology is, and what is the benefits, history, process, applications and trends of it.
What is System in a Package (SiP) technology?
System in a Package (SiP) technology is a type of packaging technology that integrates multiple components into a single package. This type of technology is also known as system on package (SOP) or system on a package (SOAP). SiP technology is an evolution of traditional packaging technology, which typically consists of a single integrated circuit (IC) in a single package. SiP technology allows for multiple components to be integrated into a single package, reducing the size and increasing efficiency.
Advantages of SiP technology
SiP technology offers several benefits over traditional packaging methods. It simplifies design and manufacturing by reducing component count and complexity, while shrinking package size and improving signal integrity. SiP also conserves power and lowers cost. Its tight integration of components also leads to improved reliability and reduced risk of failure.
| Advantage | Description |
|---|---|
| High Electrical Performance | Multiple devices integrated in SiP systems reduce solder joints and improve electrical performance. |
| Low Power Consumption | SiP offers low power consumption and low noise system connections. |
| Low System Cost | Low power consumption and low noise design can result in cost savings compared to SoC. |
| Good Stability | Good resistance to drops and corrosion, high reliability, can be used in complex electromagnetic fields. |
| Short Product Launch | Simple design, reduced complexity and shorter implementation time compared to SoC. |
| Good Compatibility | Chips of different materials and processes can be combined in one system with embedded passive components. |
| Widely Used | Can handle digital and non-digital systems, including optical communication and sensors. |
| Small Physical Size | SiP packages becoming thinner, with advanced tech resulting in 1.0mm five-layer stacked chips. |
| High Packaging Efficiency | Multiple chips in one package, reducing peripheral circuit area and creating miniaturized, high-density substrates. |
History of SiP technology
SiP technology has been around since the early 2000s, when it was first used in the development of 3G and 4G cellular networks. At the time, SiP technology was seen as a way to reduce the physical size of the packages used to integrate components into devices. This allowed for more components to be integrated into a much smaller package, increasing device performance and efficiency.
Since then, SiP technology has seen a number of advancements. Most recently, SiP technology has been used in the development of 5G networks, where it has been used to reduce the size of packages and improve the speed and accuracy of communication between components. Additionally, SiP technology has been used in the development of automotive and aerospace components, where it has been used to reduce the size and complexity of packages.
Packaging forms of SiP
The dominant packaging forms of SiP include 2D flat multi-chip module (MCM) packaging, with forms such as Stacked Die Module, Substrate Module, FcFBGA/LGA SiP, Hybrid (flip chip+wirebond) SiP-single sided, Hybrid SiP-double sided, eWLB SiP, fcBGA SiP, etc. In 2.5D packaging, there are forms such as Antenna-in-Package-SiP Laminate eWLB, eWLB-PoP & 2.5D SiP. In 3D structures, chips are stacked directly and can be assembled using lead bonding, inverted chips, or a combination of both, or through silicon via technology for interconnection.
The components that make up SiP technology include packaging carriers and assembly processes. The former includes substrates, LTCC, and Silicon Submount (which can also be an IC). The latter includes traditional packaging processes (Wirebond and FlipChip) and JI and SMT equipment. Passive components are an important part of SiP, some of which can be integrated with the carrier (Embedded, MCM-D, etc.), while others (such as high-precision, high-Q, high-value inductors and capacitors) are assembled on the carrier through SMT. The dominant packaging form of SiP is BGA. Currently, there is no special technology or material for SiP itself. This does not mean that SiP technology is mastered by possessing traditional advanced packaging technology. Due to the industrial model of SiP no longer being single OEM, module division and circuit design are also important factors. Module division refers to separating a piece of functionality from an electronic device, which is convenient for subsequent system integration and SiP packaging.
Applications of SiP technology
In the consumer electronics industry, SiP technology has been used to reduce the size and complexity of packages used to integrate components into devices. This has allowed for more components to be integrated into a smaller package, reducing the size and weight of the device and increasing its efficiency.
| Application Field | Description |
|---|---|
| Automotive electronics | SiP technology is used in the engine control unit (ECU) of automotive electronics. The ECU consists of a microprocessor (CPU), memory (ROM, RAM), input/output interface (I/O), analog-to-digital converter (A/D), and other large-scale integrated circuits. Different chips are integrated together using the SiP method to form a complete control system. |
| Medical electronics | SiP technology is used in implantable electronic medical devices, such as capsule endoscopes. Capsule endoscopes consist of optical lenses, image processing chips, radio frequency signal transmitters, antennas, and batteries. |
| Computing | SiP technology is mainly used in the computer field by integrating processors and memory. |
| Consumer electronics | Includes image processing chips (ISP) and Bluetooth chips. |
| Bluetooth systems | Bluetooth systems typically consist of a wireless part, link control part, link management support part, and main terminal interface. SiP technology makes Bluetooth smaller and more market-friendly, thereby promoting its application. |
| Military electronics | Bluetooth systems typically consist of a wireless part, link control part, link management support part, and main terminal interface. SiP technology makes Bluetooth smaller and more market-friendly, thereby promoting its application. |
| Smartphones | RFPA is the most commonly used SiP form in smartphones. |
Introduction to SiP Process
The SiP process uses a combination of bare chips/modules in a specific arrangement. It has 2 structures: 2D and 3D packaging. 3D packaging, with stacked components, increases the number of wafers/modules and improves functional integration of SiP. Internal bonding can be simple wire bonding, flip chip or both. The most advanced 3D SiP uses interposer and TSV technology to combine bare die and substrate.
SiP Substrate
A key carrier in packaging tests, the SiP substrate has technical features such as thinning, high density, and precision. It provides support, heat dissipation, and protection for the chip and connections between the chip and substrate.
Classification
Substrates can be classified by reinforcement materials and structures:
Structural: rigid or flexible.
Reinforcement materials: organic, inorganic, or composite systems.
Substrate treatment methods
There are 4 methods for SIP’s substrate machining: hot air leveling, organic soldering protection coating, chemical nickel gold, electroplating gold.
Chemical Nickel Gold:
A lower cost method of coating by chemical reaction at 80-100°C using gold salts and catalysts. But, poor control of thickness, hard surface, and poor flatness make it unsuitable for encapsulated substrates using lead bondin
Nickel-Gold Electroplating:
Electroplating is a process of depositing a layer of metal or alloy on a conductive material by using direct current in a solution. There are hard gold and soft gold electroplating processes. Hard gold adds small amounts of metal to the bath, while both processes have similar bath compositions. Nickel-gold electroplating is commonly used for surface treatment in encapsulated substrates with bonding process. Hard gold is used for aluminum wire bonding and soft gold for gold wire bonding.
Trends in SiP technology
The SiP technology market is rapidly growing, as more companies are turning to SiP technology to reduce the size and complexity of packages used to integrate components into devices. This growth is being driven by the increasing demand for more efficient and reliable devices, as well as the increasing demand for smaller and lighter devices. Additionally, SiP technology is becoming more advanced, as companies are using more sophisticated packages and components to achieve the desired performance.
Key players in the SiP technology market
The SiP technology market is dominated by a few key players. Octavo Systems is one of the leading providers of SiP technology, offering a variety of packages and components for use in a variety of applications. Additionally, Samsung and Intel are two of the leading providers of SiP technology, offering a variety of packages and components for use in a variety of applications.
Future of SiP technology
The future of SiP technology looks bright, as more companies are turning to SiP technology to reduce the size and complexity of packages used to integrate components into devices. Additionally, SiP technology is becoming more advanced, as companies are using more sophisticated packages and components to achieve the desired performance.
The SiP technology market is expected to continue to grow, as more companies are turning to SiP technology to reduce the size and complexity of packages used to integrate components into devices. Additionally, the market is expected to become more competitive, as more companies enter the market and develop new and more advanced SiP technology.
