Electrical Schematic Diagram Guide for Beginner
New to schematics? Learn symbols, netlists, and best practices for creating error-free diagrams. Tools for Altium/Eagle and collaboration tips. Beginner’s guide here!
PIC18F14K50 Microcontroller Datasheet
PIC18F14K50 Overview PIC18F14K50 is a low-cost microcontroller with advanced features and special value in the embedded USB market. It has a full-speed USB 2.0 compatible interface that can automatically change clock sources and power levels, making it ideal for battery-powered applications. PIC18F14K50 Features Processing power: High-performance PIC18 core Architecture optimized for C compiler 8×8 single-cycle
MOSFET Transistors: Types & Circuit Design
MOSFET basics: N-channel/P-channel operation, switching vs. amplifying modes, and gate drive requirements. Tips for high-power applications. Datasheet insights!
IGBT: Insulated Gate Bipolar Transistor
What is IGBT? IGBT stands for Insulated Gate Bipolar Transistor, which is a type of power semiconductor device that combines bipolar junction transistors (BJTs) and metal oxide semiconductor field-effect transistors (MOSFETs). IGBTs have high input impedance like MOSFETs and low voltage drop during conduction like giant transistors (GTRs). They are commonly used in applications where
FPC Coverlay: Benefits, Choices, Alternatives, and Challenges
If you’re in the electronics industry, you’ve likely heard of FPC coverlay. But do you know all the benefits and applications of this essential material? FPC coverlay is a thin, flexible material that is applied to a flexible printed circuit board (FPCB) to protect the copper traces from external elements. In this ultimate guide, we’ll
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VCC/VDD/GND Confusion? Clear Definitions
Struggling to differentiate VCC, VDD, VSS, and GND? Learn voltage rails, ground types, and common pitfalls in circuit design. Perfect for avoiding power supply errors. Read now!
Annular Rings in PCBs: Design & Reliability
Annular ring basics: definition, minimum width requirements, and drill size impact. Learn to avoid pad lifting and via failures. Critical for PCB manufacturability!
Redistribution Layer (RDL) Technology for ICs Package
In recent years, the redistribution layer (RDL) technology has gained significant traction. It’s a revolutionary packaging solution that has transformed the way we package ICs. In this article, we’ll explore the definition of RDL, its function, benefits, process, application, and comparision with other IC packaging technologies. What is Redistribution Layer Technology? Redistribution layer, also known
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Dual Inline Package (DIP): Guide for PCB Design
Learn DIP package basics: pin configurations, pros/cons, and through-hole soldering. Compare with SMD for your design. Layout tips for reliability. Read now!
Gerber Files Board Size Setting
Are you struggling with creating Gerber files for your PCB projects? The process of designing and producing printed circuit boards can be challenging, especially when it comes to getting the board size just right. In this article, I’ll be sharing some valuable tips to help you create Gerber files with the right board size. Importance