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Aidan Taylor

Hi, i’am Aidan Taylor, and is serving in the field of PCB Reverse Engineer, PCB design engineer, and PCB assembly technician. We have more than 10 years of experience in the PCB industry.

MCP2551-ISN CAN Transceiver

MCP2551 Interface Integrated Circuits (ICs) CAN Transceiver

Leave a Comment / Integrated Circuits & Components /

MCP2551 Overview The MCP2551 is a high-speed and high-fault-tolerant device used as a connection interface between the CAN protocol controller and the physical bus. It provides differential transmission and reception functions to the CAN protocol controller, fully compliant with the ISO-11898 standard, including 24V requirements. In a typical CAN system, each node must have a […]

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Microchip PIC16F628A Microcontroller

PIC16F628A Microcontroller – Embedded Processors and Controllers

Leave a Comment / Microcontrollers & Embedded Systems /

Overview of PIC16F628A Microcontroller The PIC16F628A devices are 8-bit flash-based microcontrollers with advantages of low-cost, high-performance, CMOS, fullystatic. All PIC® microcontrollers employ an advanced RISC architecture. The PIC16F628A have enhanced core features, an eight-level deep stack, and multiple internal and external interrupt sources. The separate instruction and data buses of the Harvard architecture allow a

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MSP430F169 Microcontroller

MSP430F169 Microcontroller

Leave a Comment / Microcontrollers & Embedded Systems /

MSP430F169 Overview The MSP430F169 Microcontroller is one of the Texas Instruments MSP430 family. It comprises multiple devices that feature distinct sets of peripherals designed for diverse applications. The architecture of these microcontrollers, coupled with five low power modes, has been fine-tuned to optimize extended battery life for portable measurement applications. Moreover, the digitally controlled oscillator

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What is a Redistribution Layer

Redistribution Layer (RDL) Technology for ICs Package

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In recent years, the redistribution layer (RDL) technology has gained significant traction. It’s a revolutionary packaging solution that has transformed the way we package ICs. In this article, we’ll explore the definition of RDL, its function, benefits, process, application, and comparision with other IC packaging technologies. What is Redistribution Layer Technology? Redistribution layer, also known

Redistribution Layer (RDL) Technology for ICs Package Read More »

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