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Dual Inline Package (DIP) Meaning
What is Dual Inline Package? DIP, or dual inline package, is a type of integrated circuit (IC) packaging that features two parallel rows of metal pins, called dual in-line pins,

Redistribution Layer (RDL) Technology for ICs Package
In recent years, the redistribution layer (RDL) technology has gained significant traction. It’s a revolutionary packaging solution that has transformed the way we package ICs. In this article, we’ll explore

Annular Rings in PCB
What is Annular Ring in PCB? The annular ring refers to the area between the hole drilled in the via and the edge of the conductive copper pad. Vias act

Power Supply Voltages Abbr: VCC VDD VEE VSS GND
In electronics, various abbreviations are used to represent different power supply voltages, such as VCC, VDD, VEE, VSS, and GND. Understanding the differences between these power supply voltages is crucial

FPC Coverlay: Benefits, Choices, Alternatives, and Challenges
If you’re in the electronics industry, you’ve likely heard of FPC coverlay. But do you know all the benefits and applications of this essential material? FPC coverlay is a thin,

IGBT: Insulated Gate Bipolar Transistor
What is IGBT? IGBT stands for Insulated Gate Bipolar Transistor, which is a type of power semiconductor device that combines bipolar junction transistors (BJTs) and metal oxide semiconductor field-effect transistors
About Author

Hi, i’m Aidan Taylor, and is serving in the field of PCB Reverse Engineering, PCB design, and IC unlock technician. We have more than 10 years of experience in the PCB industry.