Common Problems in PCB Reverse engineering

Table of Contents

pcb clone

There’re some common questions about PCB reverse engineering. Usually, to get a circuit board, you need to first remove all components and arrange them according to the number. Storage and subsequent production use. For two-layer boards, look at the circuit complexity. For two-layer boards with simple lines, special pcb software can be used to recovery boards without damage processing; for more than two-layer four-layer/six-layer or more layers The circuit board needs to use a special grinding tool to grind the board, expose each layer of the circuit, and then use the pcb software to reproduce the board. For the PCB process, there are often several problems and difficulties. How to deal with or avoid these problems often becomes several difficulties for beginners.

PCB Delamination

First of all, regarding the delamination problem, there are many reasons for this situation, such as poor quality of the board / poor workmanship / dampness of the PCB board / uneven distribution of material selection and copper thickness, which can all lead to these problems. Moisture is usually the most common reason. For this piece, it is necessary to control the packaging and sealing of PCB protection. It is best to carry out vacuum packaging.

poor plug holes

Secondly, the problem of poor plug holes is mainly caused by the failure of the technology of PCB processing factories to meet the requirements or the simplification of the process. In order to simplify the process and reduce costs, many factories use the outdated black hole process, which has a higher probability of bad plug holes. High, we generally recommend not to use this process.

deformed circuit board

The third problem, pcb board is deformed and bent. This situation is relatively easy to avoid. Most of the reasons are due to insufficient board thickness, extrusion during packaging and transportation, and insufficient imposition connection points.

the accuracy of the impedance

The fourth impedance problem, the board with impedance is generally more than four layers, the overall circuit design is more complicated, the board with impedance is usually used in the communication industry, and the accuracy of the impedance is related to the stability of the PCBA communication signal. An important indicator, Since the impedance test strips are generally made on the edge of the PCB board and will not come out with the board, the PCB factory can be shipped with the batch of impedance strips and test reports for inspection and reference. In addition, it is necessary to provide the comparison data of the board edge diameter and the board inner diameter.

the solder void of BGA

The last point, regarding the PCB board with BGA, the solder void of BGA is a problem that is easy to be ignored. If this problem occurs, the chip will not work, work poorly or have poor stability, some of which cannot be detected in the testing stage. In this case, X-RAY inspection is required after PCBA processing. It is best to perform electroplating or semi-filling in the board making process, which can effectively avoid the occurrence of solder voids.



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About Author

Aidan Taylor
Aidan Taylor

I am Aidan Taylor and I have over 10 years of experience in the field of PCB Reverse Engineering, PCB design and IC Unlock.

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