PCB Process Cases
Solder Pad Basics: Design & Soldering Tips
Learn solder pad design: size, shape, and thermal relief. Tips to avoid bridging, pad lifting, and improve joint strength. Essential for PCB assembly. Guide here!
Standard PCB Board Thickness
A comprehensive guide to standard PCB board thickness. Learn its impact on mechanical stability & electrical performance, and choose the right one for your projects.
PCB Mount: It’s Not Brain Surgery
PCB mounting and soldering are essential skills for every electronics engineer. Learn how to avoid common pitfalls and achieve successful PCB assembly. Explore component placement, soldering techniques, and how to troubleshoot issues.
Through Hole vs Surface Mount
How many do you know about through hole vs surface mount? They are two ways to connect electronics components in pcb assembly (PCBA). They are cost-effective and reliable methods of
Reflow Process Soldering: A Complete Guide
Core Concepts Process Flow Troubleshooting Comparison FAQ What is Reflow Soldering? This section lays the groundwork by explaining the fundamental “what,” “why,” and future of reflow soldering in modern electronics
IPC-A-610: The Ultimate Guide to Electronic Assembly Acceptance Standards
Complete guide to IPC-A-610: The Acceptability of Electronic Assemblies. Learn about classes, certification, requirements, and how it compares to J-STD-001.
Ultrasonic PCB Cleaners: Guide & Best Practices
Clean PCBs with ultrasonic systems: solutions, frequency, and steps to remove flux/residue. Tips for improving reliability and aesthetics. Expert guide inside!
How to Fix a Cold Solder Joint: The Ultimate Guide
What is a Cold Solder Joint? Cold solder joints, also commonly known as pseudo soldering, are one of the bad solder joints produced during the PCBA or SMT process. Because
About Well Done
Well Done Technology was established in 2008, focus on PCB reverse engineering, PCB assembly, PCB design and manufacturing. Our technical team of more than 20 people includes senior engineers with rich experience.
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