6 Layer PCB Manufacturing: The Complete Guide For PCB Designers and Manufacturers

Table of Contents

6 layer pcb board layout

What is 6-Layer PCB Manufacturing?

6-layer PCB manufacturing is the mass-production of PCBs with a minimum of six layers. In a 6-layer PCB, the top and bottom layers are usually made of laminated material which is then covered with a dielectric layer, enameling, and a conductive layer. The most common manufacturing process of PCB in 6-layer is the film-cut-route (FCR) and film-route-cut-route (FRCD) processes. In other words, these manufacturing processes are used to create a 6-layer PCB on the base of a copper film and then cut the copper film into individual boards for different products. The advantages of the 6-layer manufacturing are ease of manufacturing and low cost.

Structure of 6 Layer PCBs

The layers in a 6-layer board are as follows: – Board substrate – Substrate coating – Conductive layer – Enamel – Substrate coating – Board substrate The board substrate is the base material of the board, which is usually an FR-0 or FR-1 material. The substrate coating is a thin layer on the substrate, usually made of polyimide or polyamide. The substrate coating is usually a dissolved polyester. The substrate coating is usually a thickness of 0.33 to 0.35 mm. The conductive layer is a layer of copper, aluminum, or aluminum-tungsten. The conductive layer is the final layer on the board, and it makes the board conductive. The enamel layer is a layer of gold, silver, or copper. The enamel layer is a layer on the conductive layer, which makes the board suitable for use. The substrate coating, conductive layer, and enamel layer are all dissolved in a solvent and then coated onto the board substrate.

6 layer pcb structure
6 layer pcb structure

Applications of the 6-Layer PCB

– Modular Interconnect Systems
– Modular and Semiconductor Systems
– Semiconductor Devices
– Connectors and FPCs
– Telecommunications and Control Systems
– Consumer Electronics
– Medical Electronics
– Automotive Electronics
– Industrial Control Systems
– Aerospace Systems
– Military Systems
– Oil and Gas Systems

Why Choose 6-Layer PCB Manufacturing?

One of the most important aspects of 6-layer PCB manufacturing is that it allows for large-scale production. The standard for 6-layer manufacturing is for mass production. This mass production helps cut down on the production time and allows for the manufacturer to have a reliable supply of materials. Mass production allows for the manufacturer to meet a large demand for the 6-layer PCBs, which can help manufacturers meet the high demand for these types of boards. While 6-layer PCB manufacturing can meet the demand for functional boards, it cannot meet the demand for reliability. High-reliability boards require a PCB that has more than 6 layers. The extra layers provide the PCB with more strength and ductility. 

types of stack-up

The following is the typical 6-layer PCB circuit board stacks for reference. For the combination of six-layer boards, we recommend the scheme 3 first. The priority wiring layers are S2 (stripline), S3, and S1.

6 layer PCB circuit board stack-up (1)

Type 1

Top (signal layer)
L2 (ground plane)
L3 (signal layer)
L4 (signal layer)
L5 (power plane)
bottom (signal layer)

6 layer PCB circuit board stack-up (2)

Type 2

Top (signal layer)
L2 (signal layer)
L3 (ground plane)
L4 (power plane)
L5 (signal layer)
Bottom (signal layer)

Compared with scheme 1, scheme 2 ensures that the power supply and ground planes are adjacent to reduce the power supply impedance, but S1, S2, S3, and S4 are all exposed, and only S2 has a better reference plane.

6 layer PCB circuit board stack-up (3)

Type 3

Top (signal layer)
L2 (ground plane)
L3 (signal layer)
L4 (power plane)
L5 (ground plane)
Bottom (signal layer)

The scheme 3 reduces one signal layer and adds an internal electrical layer. Although the layers available for wiring are reduced, this scheme solves the common defects of scheme 1 and scheme 2.

6 layer PCB circuit board stack-up (4)

Type 4

Top (signal layer)
L2 (ground plane)
L3 (signal layer)
L4 (ground plane)
L5 (power plane)
Bottom (signal layer)

For a small number of local signals, the requirements are higher. Option 4 is more suitable than option 3, it can provide an excellent wiring layer S2.

PCB Board Stackup 5

Type 5

Top (signal layer)
L2 (ground plane)
L3 (signal layer)
L4 (power plane)
L5 (signal layer)
Bottom (signal layer)

Manufacturing Process

The manufacturing process of 6 layer pcb involves creating a multilayered circuit board by stacking sheets of copper foil, each with a different electrical property. The layers are then bonded together and etched with a chemical to create an electrical circuit. The process is similar to that of single-sided boards, but the additional layers require a different etching process. A 6-layer board is essentially two 3-layer boards bonded together, so the manufacturing process is the same as for a 3-layer board, with an extra etching step at the end where all the copper layers are etched together. Below are the full steps for reference:

6 layer pcb multilayers board production
1. multilayers PCB production
inner layer imaging
2. inner layer imaging
PCB copper etching
3. inner layer etching
PCB AOI test of inner layers
4. AOI of inner layers
PCB Oxidation
5. oxidation
6. multi-layer pcb bonding
PCB holes drilling
7. holes drilling
PCB through holes drilling
8. through holes drilling
PCB direct plating
9. direct plating
PCB pattern development
10. pattern development
PCB pattern plating
11. pattern plating
PCB outer layer etching
12. outer layer etching
13. AOI of outer layers
solder mask layer formation
14. solder mask layer formation
legend printing
15. legend printing
surface finish hot air solder leveling
16. surface finish: hot air solder levelling
Nickel deposition
17. surface finish: immersion gold / nickel deposition
Electrical-Testing
18. electrical testing
mechanical processing
19. mechanical processing
PCB Quality Inspection
20. final inspection

Manufacturing Equipment

The equipment used to manufacture 6-layer PCBs is a laminator, picker, etcher, and a dryer. The equipment used to manufacture 6-layer PCBs is a laminator, picker, etcher, and a dryer. The laminator is used to cut the boards and adhere to the layers, and the picker is used to remove the boards from the machine. The etcher is used to remove the coating, and the dryer is used to remove the solvent from the board after it is cast.

Materials for manufacturing

The copper stack used for 6-layer manufacturing is 0.4 mm thick, and the copper film is a 0.4 mm thick 1 oz copper. The copper stack used for 6-layer manufacturing is 0.4 mm thick, and the copper film is a 0.4 mm thick 1 oz copper. The laminate used for 6-layer manufacturing is usually FR-0 grade, which is an FR-0 with a 0.33 to 0.35 mm thickness. The laminate used for 6-layer manufacturing is usually FR-0 grade, which is an FR-0 with a 0.33 to 0.35 mm thickness. The dielectric used for 6-layer manufacturing is usually a polyester or a polyimide. The dielectric used for 6-layer manufacturing is usually a polyester or a polyimide. The thermal barrier used for 6-layer manufacturing is usually glass or ceramic. The thermal barrier used for 6-layer manufacturing is usually glass or ceramic.

Tips

– Remember that high volume production is a requirement for 6-layer manufacturing.
– When designing the 6-layer PCB, try to create a standard footprint. This allows for easy board fabrication.
– In order for 6-layer PCBs to meet the requirements of reliable and high performance, the design should be tested. The design should be verified for functionality, and the design should be verified for manufacturability.
– Ensure that the quality of your PCB manufacturing is consistent. It is important to test your boards before you ship them out.

Electronic components such as resistors, capacitors, transistors, diodes, and ICs are becoming smaller and more complex. As a result, the need for reliable and high-quality components is rising. The 6-layer PCB manufacturing process is a low-cost and efficient way to mass-produce these components.

Share:

Facebook
Twitter
Pinterest
LinkedIn

Leave a Comment

Your email address will not be published.

About Author

Aidan Taylor
Aidan Taylor

I am Aidan Taylor and I have over 10 years of experience in the field of PCB Reverse Engineering, PCB design and IC Unlock.

Share

Most Popular

Get The Latest Updates

Subscribe To Our Weekly Newsletter

No spam, notifications only about new products, updates.

Related Posts

welldone pcb manufacturer

Start to Achieve Your PCB Project

Open chat
Scan the code
Hello 👋
Can we help you? Chat with us on WhatsApp↓, or send an email to us: info@reversepcb.com