Microprobe Solutions for High-Density PCB Testing
The definitive guide to microprobe technology. Explore how material science, tip geometry, and spring force converge to ensure zero-defect PCB manufacturing.
Industry Benchmarks
Vital statistics for microprobe performance in 2024
Interactive Probe Configurator
Selecting the correct microprobe is critical to avoiding damage to pads and ensuring accurate readings. Use this tool to find the optimal probe geometry based on your PCB's physical constraints and target type.
Configuration
Select a plating to see specific advantages.
Configure options to generate a recommendation.
Lead-Free vs. Leaded Solder:
The Hardness Challenge
SAC305 lead-free solders are significantly harder than traditional SnPb alloys and form thick oxide layers. Standard probes often "skate" on the surface, causing false open circuits.
Problem: Poor Penetration
Oxide layers prevent electrical connection unless the tip has sufficient hardness and spring pressure.
Solution: High-Force Spear Tips
30° Hardened Steel tips at 150g spring force pierce through oxides directly for reliable electrical contact.
Technical Comparison Table
| Solder Chemistry | Leaded (SnPb) | Lead-Free (SAC) |
| Surface Hardness | Low | High (16-22 HV) |
| Recommended Plunger | BeCu / Gold | Hardened Steel |
| Min. Force Requirement | 80g | 150g |
Material Durability Lab
The choice of base material (plunger) and plating significantly impacts the probe's cycle life and contact resistance stability.
Key Insights
- ● BeCu (Beryllium Copper): Standard for low resistance, but softer. Best for gold pads.
- ● Steel (Hardened): Higher durability, higher resistance. Essential for abrasive flux residues.
- ● Wear Point: Resistance spikes typically indicate plating wear-through, leading to false failures.
Data simulated based on standard industry stress tests (ASTM B667 equivalent).
Tech Specs Dashboard
Visual mapping of probe geometries to functional application scenarios.
30° Sharp Spear
Pierces hard oxide layers. High-pressure contact for absolute electrical continuity.
9-Point Serrated
Self-cleaning geometry. Displaces flux residue with redundant contact points.
Radius / Flat
Non-destructive contact for ENIG/Gold surfaces. Zero physical indentation.
Tip Geometry Reference
Matching the physical shape of the probe tip to the contaminant and target type.
Spear / Point
Single point of contact.
Crown / Serrated
Multiple contact points.
Cup / Concave
Captures the target.
Flat
Non-destructive contact.
Maintenance Hub
Operator protocols for Flying Probe lifecycle optimization.
Visual QC
Check for 'Tinning' or blunting under 50x magnification weekly.
Ultrasonic
3-min cycle in pure IPA to remove flux without mechanical force.
Lubrication
Apply dry-film lubricant to Rhodium tips to prevent solder pickup.
Verification
Measure R-Contact on a gold standard board. Must be < 30mΩ.
Microprobe PCB Testing Industry Standard
Technical Specification Sheet
