Desain & Pembuatan PCB, Sirkuit & Manufaktur

Kalkulator Impedansi PCB

Hitung impedansi karakteristik dan impedansi diferensial PCB untuk mikrostrip dan stripline. Mendukung pasangan yang terhubung melalui tepi dengan rumus yang akurat dan diagram visual.

1. Pilih Tipe Jalur (Trace)

Microstrip

Stripline

Edge-Coupled Microstrip

Edge-Coupled Stripline

2. Masukkan Parameter

Konstanta Dielektrik (μ_r)

Ketebalan Jalur (T)

mils

Lebar Jalur (W)

mils

Ketebalan Substrat (H)

mils

Jarak Antar Jalur (S)

mils

Diagram Microstrip

Rumus

Z_{o} \approx \frac{87}{μ_{r} + < 1.41} \ln (\frac{5.98 H}{0.8 W + T})

Diagram Stripline

Rumus

Z_{o} \approx \frac{60}{μ_{r}} \ln (\frac{1.9 B}{0.8 W + T})

Diagram Coupled Microstrip

Rumus

Z_{diff} \approx 2 \cdot Z_{o} (<1 - 0.347 e^{- 2.9 \frac{S}{H}})

Diagram Coupled Stripline

Rumus

Z_{diff} \approx 2 \cdot Z_{o} (<1 - 0.748 e^{- 1.5 \frac{S}{B}})

3. Hasil Kalkulasi

Impedansi Karakteristik (Zo)-- Ω

Penafian: Kalkulasi ini hanya untuk tujuan estimasi. Untuk desain akhir, selalu gunakan perangkat lunak simulasi profesional.

Panduan Penggunaan

Pilih Jenis
Jalur Pilih salah satu dari empat konfigurasi jalur dengan ikon visual:
- Microstrip: Jalur tunggal pada lapisan luar di atas bidang ground.
- Stripline: Jalur tertanam di antara dua bidang ground.
- Microstrip Terhubung Tepi: Pasangan diferensial pada lapisan luar.
- Stripline Terhubung Tepi: Pasangan diferensial tertanam di antara bidang ground.
Masukkan Parameter
- Konstanta Dielektrik (εr): Permittivitas listrik bahan (misalnya, 4,4 untuk FR-4).
- Ketebalan Jalur (T): Ketebalan tembaga dalam mil (1 oz = 1,37 mil).
- Lebar Jalur (W): Lebar konduktor dalam mil.
- Tinggi Substrat (H)/Jarak Antar-Plane (B): Jarak ke plane ground.
- Jarak Jalur (S): Muncul untuk pasangan diferensial; jarak antar jalur.
Lihat Hasil
- Impedansi Karakteristik (Zo): Untuk jalur tunggal.
- Impedansi Diferensial (Zdiff): Untuk pasangan terhubung, ditampilkan secara otomatis untuk tipe terhubung tepi.

Penjelasan Rumus

Impedansi Microstrip Ujung Tunggal

Z 0 = \frac{87}{\sqrt{ε_{r} + 1.41}} • \ln (\frac{5.98 H}{0.8 W + T})

Variables:

Z₀: Characteristic impedance of the microstrip line (Ω)
- Key parameter for single-ended signal integrity
- Typical target: 50Ω for RF, 60-70Ω for digital signals
ε_r: Substrate dielectric constant
- FR-4: 4.2-4.6 @ 1MHz
- Rogers RO3003: 3.0 @ 10GHz
H: Substrate height from trace to ground plane (mils)
- Also known as dielectric height
- Thinner H increases Z₀ for same trace width
W: Trace width (mils)
- Wider traces lower Z₀ linearly
- Minimum width limited by manufacturing (typically ≥4mils)
T: Trace thickness (mils)
- 1oz copper: 1.37mils (35μm)
- 2oz copper: 2.74mils (70μm)

Impedansi Jalur Simetris

Z 0 = \frac{60}{\sqrt{ε_{r}}} • \ln (\frac{1.9 B}{0.8 W + T})

Variables:

Z₀: Characteristic impedance of stripline (Ω)
- Enclosed between two ground planes for better shielding
- Typical target: 50Ω for controlled impedance designs
ε_r: Dielectric constant of core material
- High-frequency materials: ε_r stability critical
- Example: Isola FR408HR: ε_r=3.48 @ 10GHz
B: Total distance between ground planes (mils)
- Also called "plane separation" or "stackup height"
- B = 2H for symmetric stripline with centered trace
W: Trace width (mils)
- Narrower W increases Z₀ in stripline designs
- Width-to-thickness ratio affects field distribution
T: Trace thickness (mils)
- Thicker traces reduce DC resistance but impact Z₀ slightly
- Considered in denominator for geometric correction

Impedansi Diferensial Microstrip yang Terhubung Tepi

Z_{diff} = 2 • Z 0 • (1 - 0.347 • e^{- \frac{2.9 S}{H}})

Variables:

Z_diff: Differential impedance of coupled microstrip (Ω)
- Typical targets: 100Ω (USB), 90Ω (Ethernet)
- Depends on both single-ended Z₀ and coupling factor
Z₀: Single-ended microstrip impedance (Ω)
- Base impedance of each trace in the pair
- Assumes infinite ground plane for isolation
S: Spacing between coupled traces (mils)
- Critical for crosstalk and differential impedance control
- S/H ratio determines exponential coupling factor
- Common rule: S ≥ 2W for minimal crosstalk
H: Substrate height (mils)
- Affects field penetration into substrate
- Lower H increases electromagnetic coupling between traces

Impedansi Diferensial Jalur Garis yang Terhubung Tepi

Z_{diff} = 2 • Z 0 • (1 - 0.748 • e^{- \frac{1.5 S}{B}})

Variables:

Z_diff: Differential impedance of coupled stripline (Ω)
- Preferred for high-speed signals requiring low EMI
- Typical value: 100Ω for DDR4 differential pairs
Z₀: Single-ended stripline impedance (Ω)
- Impedance of each trace when isolated
- Calculated using symmetric stripline formula
S: Spacing between coupled traces (mils)
- Smaller S increases differential impedance due to coupling
- Exponential term: e^-1.5S/B models field overlap
B: Plane separation (mils)
- Total distance between top and bottom ground planes
- B = 2H for centered traces in symmetric stackups
- Larger B reduces coupling effect for same trace spacing

Pertanyaan yang Sering Diajukan

Apa itu impedansi karakteristik (Z₀)?

Characteristic impedance is the resistance a signal "sees" as it travels along a transmission line, determined by trace geometry and material properties. A mismatch in

Z 0

causes signal reflections, degrading integrity. For example, a microstrip with

W = 10 mils

H = 6 mils

, and

ε r = 4.4

has:

Z 0 = 87 \sqrt (ε r + 1.41) \cdot ln (5.98 \cdot H 0.8 \cdot W + T) \approx 50 Ω

Apa perbedaan antara microstrip dan stripline?

Microstrip: Single trace on the surface with a ground plane below.
- Advantages: Easy to route, suitable for low-frequency designs.
- Disadvantages: Radiates EMI, sensitive to board flexing.
Stripline: Trace sandwiched between two ground planes.
- Advantages: Better EMI shielding, stable at high frequencies.
- Disadvantages: Requires inner layers, more complex to route.

Bagaimana jarak jejak memengaruhi impedansi diferensial?

In edge-coupled pairs, increased spacing

S

reduces electromagnetic coupling, increasing differential impedance

Z diff

. For microstrips:

Z diff = 2 \cdot Z 0 \cdot (1 - 0.347 \cdot e -2.9S/H)

When $S = H$ : $Z diff \approx 2Z 0 \cdot 0.76$
When $S = 3H$ : $Z diff \approx 2Z 0 \cdot 0.97$

Apa perbedaan antara impedansi single-ended dan impedansi diferensial?

Parameter	Single-Ended (Z₀)	Differential (Z_diff)
Definition	Impedance from trace to ground	Impedance between two coupled traces
Typical Values	50Ω (RF), 60-70Ω (digital)	100Ω (USB), 90Ω (Ethernet)
Application	Single-ended signals (e.g., GPIO)	Differential signals (e.g., LVDS, PCIe)
Design Focus	Trace width and ground plane distance	Trace spacing and coupling coefficient

Differential pairs offer better noise immunity because the differential signal cancels common-mode noise. For example, USB 3.0 requires with and on a 6-mil FR-4 substrate.

Mengapa memilih Microstrip Terhubung Tepi daripada Stripline untuk pasangan diferensial?

Microstrip: Lebih mudah untuk dirutekan, tetapi memancarkan EMI dan sensitif terhadap tekukan papan.
Stripline: Pelindung yang lebih baik, gangguan silang yang lebih sedikit, dan lebih stabil pada frekuensi tinggi, tetapi memerlukan lapisan dalam.

Peran apa yang dimainkan oleh konstanta dielektrik (εr) dalam impedansi?

A higher

ε r

increases the effective permittivity of the transmission line, decreasing

Z 0

. For example:

FR-4 ( $ε r = 4.4$ ): $Z 0 \approx 50 Ω$ for $W = 10 mils, H = 6 mils$
Rogers RO3003 ( $ε r = 3.0$ ): $Z 0 \approx 58 Ω$ for the same geometry

Key Dielectric Properties

$ε r$ : Relative permittivity, affects field confinement.
- High-frequency materials: $ε r$ stability is critical
- Example: Isola FR408HR: $ε r = 3.48$ @ 10GHz
Loss Tangent (Df): Energy loss factor, impacts signal attenuation.
- FR-4: Df ≈ 0.02 @ 1MHz
- Rogers RO4350B: Df = 0.004 @ 10GHz

Seberapa akurat perhitungan-perhitungan ini?

Results are based on IPC-standard approximations. Real-world factors like:

Trace roughness (e.g., 2.1μm RMS)
Solder mask thickness (0.5-1.0mils)
Manufacturing tolerances (±10% for trace width)
Dielectric thickness variation (±5%)

Baca Selengkapnya »

Rekayasa Balik PCB

Rekayasa Terpadu PCB

Desain & Perakitan

Pengujian & Pemecahan Masalah

Penghitung Lebar Jalur

Kalkulator Impedansi PCB

1. Pilih Tipe Jalur (Trace)

2. Masukkan Parameter

Diagram Microstrip

Rumus

Diagram Stripline

Rumus

Diagram Coupled Microstrip

Rumus

Diagram Coupled Stripline

Rumus

3. Hasil Kalkulasi

Panduan Penggunaan

Penjelasan Rumus

Impedansi Microstrip Ujung Tunggal

Impedansi Jalur Simetris

Impedansi Diferensial Microstrip yang Terhubung Tepi

Impedansi Diferensial Jalur Garis yang Terhubung Tepi

Pertanyaan yang Sering Diajukan

Alat PCB Terkait

Kalkulator Daya Tahan Baterai

Kalkulator KVA Trafo

Kalkulator Arus Hubung Singkat

Kalkulator CRC Online – Alat Gratis

Kalkulator Impedansi Trafo

Kalkulator Resistansi Termal

Kalkulator Biaya Perakitan PCB

Alat Analisis Biaya Prototipe PCB

Perusahaan

Layanan Pelanggan

Kontak

Rekayasa Balik PCB

Rekayasa Terpadu PCB

Desain & Perakitan

Pengujian & Pemecahan Masalah

Kalkulator Impedansi PCB

1. Pilih Tipe Jalur (Trace)

2. Masukkan Parameter

Diagram Microstrip

Rumus

Diagram Stripline

Rumus

Diagram Coupled Microstrip

Rumus

Diagram Coupled Stripline

Rumus

3. Hasil Kalkulasi

Panduan Penggunaan

Penjelasan Rumus

Impedansi Microstrip Ujung Tunggal

Impedansi Jalur Simetris

Impedansi Diferensial Microstrip yang Terhubung Tepi

Impedansi Diferensial Jalur Garis yang Terhubung Tepi

Pertanyaan yang Sering Diajukan

Alat PCB Terkait

Penawaran Seketika

Instant Quote